Yangzhou Kaihong Power Technology Co., Ltd. (Yangzhou Headquarters)
Sales phone: 0514-87979963
Sales Straight 1: 13773587351
Sales line 2: 18932373905
Sales line 3: 15190420406
Company Fax: 0514-87580922
Sales email: firstname.lastname@example.org
Company address: Xi'an Jiaotong University Pioneer Park, East Wuzhou Road, Yangzhou
Electroplating power is a direct current device that converts power frequency AC power into different voltages, frequencies and waveforms. The rectifier technology is mainly used in thyristor rectifiers, and both the rectifier technology and the inverter technology are used in high-frequency switching power supplies. Plating power is mainly composed of main circuit and control circuit.
The main circuit mainly includes a main transformer, a power rectifier, and some detection and protection devices. The main transformer in the electroplating power supply reduces the AC power supply voltage to the voltage value required for the electroplating process. The thyristor rectifier uses a power frequency (50Hz) transformer, and the high frequency switching power supply uses a high frequency (10-50kHz) transformer. The detection device includes a voltmeter, a current transformer, and the like. The protection device is mainly used for overcurrent protection of power rectifier devices.
Control circuits include trigger control circuits such as thyristors or IGBTs, soft-start circuits for power supplies, overcurrent and overvoltage protection circuits, and power phase loss protection circuits.
Suitable for electroplating of non-ferrous metals such as zinc plating, nickel plating, tin plating, chrome plating, copper plating, cadmium plating, and precision plating of precious metals such as gold plating and silver plating.
1. When the porosity is reduced, the formation rate of crystal nuclei is faster than the growth rate, which promotes the refinement of crystal nuclei.
2. Improve the bonding force and make the passivation film breakdown, which is conducive to the strong bonding between the substrate and the plating layer.
3． Improve the covering ability and dispersing ability. The high negative cathode potential can also deposit the passivated parts in ordinary electroplating, slowing down the "burnt" and "dendritic" deposition of the protruding parts of the complex parts due to excessive consumption of the deposited ions. Defects, for obtaining a given characteristic coating (such as color, no porosity, etc.) the thickness can be reduced to the original 1/3 ~ 1/2, saving raw materials.
4． Reduce the internal stress of the coating, improve lattice defects, impurities, voids, nodules, etc., easy to obtain a coating without cracks, and reduce additives.
5. Conducive to obtaining a stable alloy coating.
6. Improve anode dissolution without anode activator.
7. Improving the mechanical and physical properties of the coating, such as increasing the density, reducing surface resistance and bulk resistance, improving toughness, wear resistance, corrosion resistance and controlling the hardness of the coating.
Traditional electroplating inhibits the occurrence of side effects, improves the current distribution, adjusts the liquid-phase mass transfer process, and controls the crystal orientation. It has no effect. The research of complexing agents and additives has become the main direction of electroplating process research. Nano switching power supply solves the defects of traditional rectifiers.
8. Improve product yield and product quality.
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